Calcium-Modified Silk Patch as a Next-Generation Ultrasound Coupling Medium

Author

S.-M. Lee†, T. Lee†, H. Kim, Y. Jo, M.-G Kim, S. Kim, H.-M. Bae, and H. J. Lee*

Journal

ACS Applied Materials & Interfaces

Vol

13

Page

55827–55839

Year

2021

Link

https://pubs.acs.org/doi/abs/10.1021/acsami.1c16735 394회 연결