Calcium-Modified Silk FIlm as a Patch-Type Ultrasound Coupling Medium

S.-M. Lee†, T. Lee†, H. Kim, Y. Jo, S. Kim, and H. J. Lee*, 2022 MRS Spring Meeting & Exhibit, Honolulu, Hawaii, May 8-13, 2022.

Noninvasive Dual-Modality Transcranial Focused Ultrasound and Direct Current Brain Stimulation in Small Animals

R. Yu, J. Lim, Y. Jo, H. J. Lee*, 10th International IEEE EMBS Conference on Neural Engineering (NER), Virtual, May 4-6, 2021.

Highly Stretchable Microelectrode Array for Free-form 3D Neuronal Tissue

C. Shim, Y. Jo, H. K. Cha, M. K. Kim, H. Kim, G. Kook, K. Kim, G. H. Son, and H. J. Lee*, Proc. 33rd IEEE MEMS Conference, Vancouver,

Calcium-Modified Silk Adhesive as Coupling Medium for Next-Generation Ultrasound Patch Applications

T. Lee, S.-M. Lee, H. Kim, M. G. Kim, H. M. Bae, and H. J. Lee*, Proc. 42nd IEEE EMBC, Montreal (Virtual), Jul. 20-24, 2020.

[Invited Talk] Neurotechnology: Where Engineering Meets Neuroscience

H. J. Lee*, 2019 International Solid-State Circuits Conferences (ISSCC), San Francisco, CA, Feb. 17-21, 2019.

Flexible Neural Probe with Controlled Release of Anti-inflammatory Drug

M. K. Kim, K. Kim, G. Eom, G. Kook, and H. J. Lee*, 9th International IEEE/EMBS Conference on Neural Engineering (NER), San Francisco, CA, Mar. 20-23, 2019. ​

RL-GAN-Net: A Reinforcement Learning Agent Controlled GAN Network for Real-Time Point Cloud Shape Completion

Muhammad Sarmad, H. J. Lee*, and Y. M. Kim*, The IEEE Conference on Computer Vision and Pattern Recognition (CVPR), Long Beach, California, June 16-20, 2019.

[Invited Talk] MEMS transducers for non-invasive ultrasound brain stimulation

H. Kim, S. Kim, S.-M. Lee, B. B. Kang, Y. Jo, G. Kook, C. Oh, M. K. Kim, H. Kim, and H. J. Lee*, Transducers 2019 - EUROSENSORS XXXIII, Berlin, Germany, June 23-27, 2019.

Effect of Transcranial Ultrasound Stimulation of the Prefrontal Cortex on Sleep in Freely Moving Mice

Y. Jo, S. Kim, H. Kim, S. Lee, and H. J. Lee*, Y. Jo, Proc. 41st IEEE EMBC, Berlin, Germany, July 23-27, 2019.

Minimally Invasive Medical Catheter with Highly Flexible FDSOI-based Integrated Circuits

S.-Y. Kim, J. H. Bong, M. K. Kim, W. S. Hwang, H. J. Lee, B.-W. Song, I.-K. Kim, and B. J. Cho*, IEEE International Electron Devices Meeting (IEDM), SF, CA, USA, Dec. 7-11, 2019.

Wafer-scale fabrication of biodegradable silk-fibroin-based memristors

G. Kook, S. H. Jeong, M. K. Kim, S. W. Lee, H. J. Kim, N. K. Choi, H. J. Lee*, Proc. 31st IEEE MEMS Conference, Northern Ireland, 2018.,

Capacitive Micromachined Ultrasonic Transducer (CMUT) ring array for transcranial ultrasound neuromodulation

H. Kim, S. Kim, and H. J, Lee*, Proc. 40th IEEE EMBC, Hawaii, USA., July 17-21, 2018.

Impact of the skull model on simulated TFUS beam profile

C. Pasquinelli, H. Montanaro, E. Neufeld, H. J. Lee, A. Thielscher*, Proc. 40th IEEE EMBC, Hawaii, USA., July 17-21, 2018.

Capacitive Micromachined Ultrasonic Transducer (CMUT)-based Biosensor for Detection of Low Concentration Neuropeptide

S. Lee, G. Eom, I. Yoon, S. Park, G. Kook, M. K. Kim, H. Kim, J.-W. Seo, and H. J. Lee, Proc. 40th IEEE EMBC, Hawaii, USA., July 17-21, 2018. ​

Electrochemical Detection of Neuropeptide for Diagnosis of Alzheimer’s Disease

G. Eom, C. Oh, M. K. Kim, H. Kim, and H. J. Lee*, Proc. 40th IEEE EMBC, Hawaii, USA., July 17-21, 2018.