An integrated circuit with transmit beamforming flip-chip bonded to a 2-D CMUT array for 3-D ultrasound imaging

Author

I. O. Wygant

Co-author

N. S. Jamal, H. J. Lee, A. Nikoozadeh, Ö. Oralkan, M. Karaman, and B. T. Khuri-Yakub*

Journal

IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control

Vol

56 (10)

Year

2009

File

An integrated circuit with transmit beamforming flip-chip bonded to a 2-D CMUT array for 3-D ultrasound imaging.pdf (1.4M) 8회 다운로드

Link

https://ieeexplore.ieee.org/document/5306761/ 474회 연결