Fabrication of Capacitive Micromachined Ultrasonic Transducers With High-k Insulation Layer Using Silicon Fusion Bonding

Author

S. Bang, C. Oh, S.-M. Lee, S. Kim, T. Lee, S. Nam, J. Jung, and H. J. Lee*

Journal

Journal of Microelectromechanical Systems

Vol

34

Page

65 - 72

Year

2025

Link

https://ieeexplore.ieee.org/abstract/document/10817139 125회 연결