List 검색 Fabrication of Capacitive Micromachined Ultrasonic Transducers With High-k Insulation Layer Using Silicon Fusion Bonding Author S. Bang, C. Oh, S.-M. Lee, S. Kim, T. Lee, S. Nam, J. Jung, and H. J. Lee* Journal Journal of Microelectromechanical Systems Vol 34 Page 65 - 72 Year 2025 Link https://ieeexplore.ieee.org/abstract/document/10817139 126회 연결