Cu/dielectric hybrid bonding: Experimental and simulation perspectives

Author

Seunghyeon Nam†, Jaewon Kim† , Byeongjun An , Hyunjoo J. Lee*

Journal

Materials Science in Semiconductor Processing

Vol

199

Page

109853

Year

2025

Link

https://www.sciencedirect.com/science/article/pii/S1369800125005906 24회 연결

Link

https://doi.org/10.1016/j.mssp.2025.109853 21회 연결