An integrated circuit with transmit beamforming flip-chip bonded to a 2-D CMUT array for 3-D ultrasound imaging

I. O. Wygant, N. S. Jamal, H. J. Lee, A. Nikoozadeh, Ö. Oralkan, M. Karaman, and B. T. Khuri-Yakub*, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, 56 (10)