Electrowetting-On-Dielectric-Based Microbubble Patterning for Spatial Ultrasound Modulation (Poster presentation)

Subeen Kim, Sangho Bang, Yehhyun Jo, and Hyunjoo J. Lee*, Subeen Kim, 2025 IEEE 38th International Conference on Micro Electro Mechanical Systems (MEMS), Kaohsiung, Taiwan, January 19-23

Optimization and Structural Modeling of Pre-snapback Mode CMUT for Enhanced Acoustic Performance (Poster presentation)

Seyoung Park, Chaerin Oh, Wonjun Lee, and Hyunjoo J. Lee*, Seyoung Park, 2025 IC-UEBA, 2025.06.15~2025.06.18

Single-bias Dual-mode CMUT Array Utilizing Pre-snapback Region for Acoustic Hologram (Oral presentation)

Seyoung Park, Chaerin Oh, Geon Kook, Sangho Bang, Hyunjoo J. Lee*, Seyoung Park, 2025 MEMS, 2025.01.19~2025.01.23

Conformal Ultrasound Patch for Real-Time Blood Flow Monitoring

Taemin Lee, Jongcheol Park, Il-Seop Kim, Sangho Bang, Joontaek Jung, Hyunjoo J Lee, 2025 IEEE 38th International Conference on Micro Electro Mechanical Systems (MEMS), Kaohsiung, Taiwan, January 19-23, 2025

Development of Flex-to-Rigid Capacitive Micromachined Ultrasound Transducer (CMUT) with Bending Modulation

Sang-Mok Lee, Taemin Lee, Chaerin Oh, Hyunjoo J Lee, 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers), Kyoto, Japan, June 25-29, 2023

Calcium-Modified Silk Adhesive as Coupling Medium for Next-Generation Ultrasound Patch Applications

Taemin Lee, Hyojung Kim, Myeong Gee Kim, Hyeon-Min Bae, Hyunjoo Jenny Lee, 42nd Annual International Conferences of the IEEE Engineering in Medicine and Biology Society in conjunction with the 43rd Annual Conference of the Canadian Medical and Biological Engineering Society (EMBC 2020), Montreal, Canada (virtual), July 20-24, 2020

CMUT Humidity Sensor with a Calcium-Modified Silk Functionalized Layer

T. Lee, S.-M. Lee, and H. J. Lee*, 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), Seoul, Korea, March 7-10, 2023,

A flexible neural probe with electrodeposited silk composite as an insertion shuttle

M. K. Kim, J. C. Leong, and H. J. Lee*, 7th IEEE ETDM, Seoul, Korea,

Calcium-Modified Silk FIlm as a Patch-Type Ultrasound Coupling Medium

S.-M. Lee†, T. Lee†, H. Kim, Y. Jo, S. Kim, and H. J. Lee*, 2022 MRS Spring Meeting & Exhibit, Honolulu, Hawaii, May 8-13, 2022.

An integrated circuit with transmit beamforming and parallel receive channels for real-time three-dimensional ultrasound imaging

I. O. Wygant, H. J. Lee, A. Nikoozadeh, Ö. Oralkan, M. Karaman, and B. T. Khuri-Yakub*, Proc. IEEE Ultrason. Symp., Vancouver, Canada, pp. 2186-2189,

An integrated circuit with transmit beamforming and parallel receive channels for 3D ultrasound imaging: Testing and characterization

I. Wygant, N. S. Jamal, H. J. Lee, A. Nikoozadeh, X. Zhuang, O. Oralkan, A. S. Ergun, M. Karaman, and B. T. Khuri-Yakub*, Proc. IEEE Ultrason. Symp., New York, USA, pp. 25-28,

Fabricating capacitive micromachined ultrasonic transducers with direct wafer-bonding and LOCOS technology. ​

K. K. Park, H. J. Lee, M. Kupnik, Ö. Oralkan, and B. T. Khuri-Yakub*, Proc. 21th IEEE MEMS Conference, Tucson, USA, pp. 339-342,

CMUT as a chemical sensor for DMMP Detection

H. J. Lee, K. K. Park, Ö. Oralkan, M. Kupnik, and B. T. Khuri-Yakub*​, Proc. IEEE Intern. Frequ. Contr. Symp., Honolulu, Hawaii, pp. 434-439,

Optimum design of circular CMUT membranes for high quality factor in air

K. K. Park, H. J. Lee, P. Cristman, M. Kupnik, Ö. Oralkan, and B. T. Khuri-Yakub*, Proc. IEEE Ultrason. Symp., Beijing, China, pp. 504-507,

A low-noise oscillator based on a multi-membrane CMUT for high sensitivity resonant chemical sensors

H. J. Lee, K. K. Park, P. Cristman, Ö. Oralkan, M. Kupnik, and B. T. Khuri-Yakub*, Proc. 22th IEEE MEMS Conference, Sorrento, Italy, pp. 761-764,