Brain/Bio Medical Microsystems Lab

Publications

Conferences

Calcium-Modified Silk Adhesive as Coupling Medium for Next-Generation Ultrasound Patch Applications
Author
Taemin Lee, Hyojung Kim, Myeong Gee Kim, Hyeon-Min Bae, Hyunjoo Jenny Lee
Conference
42nd Annual International Conferences of the IEEE Engineering in Medicine and Biology Society in conjunction with the 43rd Annual Conference of the Canadian Medical and Biological Engineering Society (EMBC 2020), Montreal, Canada (virtual)
Date
July 20-24, 2020
Year
2020
.