Minimally Invasive Medical Catheter with Highly Flexible FDSOI-based Integrated Circuits

S.-Y. Kim, J. H. Bong, M. K. Kim, W. S. Hwang, H. J. Lee, B.-W. Song, I.-K. Kim, and B. J. Cho*, IEEE International Electron Devices Meeting (IEDM), SF, CA, USA, Dec. 7-11, 2019.

Highly Stretchable Microelectrode Array for Free-form 3D Neuronal Tissue

C. Shim, Y. Jo, H. K. Cha, M. K. Kim, H. Kim, G. Kook, K. Kim, G. H. Son, and H. J. Lee*, Proc. 33rd IEEE MEMS Conference, Vancouver,

Calcium-Modified Silk Adhesive as Coupling Medium for Next-Generation Ultrasound Patch Applications

T. Lee, S.-M. Lee, H. Kim, M. G. Kim, H. M. Bae, and H. J. Lee*, Proc. 42nd IEEE EMBC, Montreal (Virtual), Jul. 20-24, 2020.

Noninvasive Dual-Modality Transcranial Focused Ultrasound and Direct Current Brain Stimulation in Small Animals

R. Yu, J. Lim, Y. Jo, H. J. Lee*, 10th International IEEE EMBS Conference on Neural Engineering (NER), Virtual, May 4-6, 2021.