Brain/Bio Medical Microsystems Lab
Publications
Conferences
Calcium-Modified Silk Adhesive as Coupling Medium for Next-Generation Ultrasound Patch Applications
Taemin Lee, Hyojung Kim, Myeong Gee Kim, Hyeon-Min Bae, Hyunjoo Jenny Lee, 42nd Annual International Conferences of the IEEE Engineering in Medicine and Biology Society in conjunction with the 43rd Annual Conference of the Canadian Medical and Biological Engineering Society (EMBC 2020), Montreal, Canada (virtual), July 20-24, 2020
Highly Stretchable Microelectrode Array for Free-form 3D Neuronal Tissue
C. Shim, Y. Jo, H. K. Cha, M. K. Kim, H. Kim, G. Kook, K. Kim, G. H. Son, and H. J. Lee*, Proc. 33rd IEEE MEMS Conference, Vancouver,
T. Lee, S.-M. Lee, H. Kim, M. G. Kim, H. M. Bae, and H. J. Lee*, Proc. 42nd IEEE EMBC, Montreal (Virtual), Jul. 20-24, 2020.
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