Fabricating capacitive micromachined ultrasonic transducers with direct wafer-bonding and LOCOS technology. ​

Author

K. K. Park, H. J. Lee, M. Kupnik, Ö. Oralkan, and B. T. Khuri-Yakub*

Conference

Proc. 21th IEEE MEMS Conference, Tucson, USA, pp. 339-342

Year

2008