Calcium-Modified Silk Adhesive as Coupling Medium for Next-Generation Ultrasound Patch Applications

Author

T. Lee, S.-M. Lee, H. Kim, M. G. Kim, H. M. Bae, and H. J. Lee*

Conference

Proc. 42nd IEEE EMBC, Montreal (Virtual)

Date

Jul. 20-24, 2020.

Year

2020