Cu/dielectric hybrid bonding: Experimental and simulation perspectives

Seunghyeon Nam†, Jaewon Kim† , Byeongjun An , Hyunjoo J. Lee*, Materials Science in Semiconductor Processing, 199 ,109853

Selective manipulation of excitatory and inhibitory neurons in top-down and bottom-up visual pathways using ultrasound stimulation

Y. Jo†, X. Liang†, H. Nguyen, Y. Choi, M. Choi, G.-E. Bae, Y. Cho, J. Woo, H. J. Lee*, Brain stimulation, Volume 18, Issue 3 ,848-862

Fabrication of Capacitive Micromachined Ultrasonic Transducers With High-k Insulation Layer Using Silicon Fusion Bonding

S. Bang, C. Oh, S.-M. Lee, S. Kim, T. Lee, S. Nam, J. Jung, and H. J. Lee*, Journal of Microelectromechanical Systems, 34 ,65 - 72